Welcome at my-Chip Production

NEW MATERIALS - NEW PRODUCTION METHODS

My-Chip Production GmbH is an innovative producer of stand alone and cluster machines and service provider (job-shops) in the fields of

Diamond Multi-Micro-Wire-Saw DMMWS cutting sapphire only with city water --- CLICK to enlarge ---

Cutting of brittle materials (Si, sapphire, GaAs, SiC, piezo, glass, magnets, Al2O3, etc.) by job-shops
Thinning and dicing of ultrathin silicium wafers (for RFID, etc.)
Production of individual processes and full process lines to cut brittle materials and to thin and dice ultrathin silicium wafers
Training
Service


Wire-saw DMMWS cutting sapphire only with city water --- CLICK to enlarge ---

For more detailed information please check our offers and our company profile.
 

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