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My-Chip Production GmbH cuts

brittle materials

such as
- silicium
- sapphire
- GaAs
- SiC
- piezo
- glass
- magnets
- Al2O3
- all kinds of monocrystals
- compound materials
- etc. in job-shops

C U T T I N G   I N   J O B - S H O P S 

We are focused in very low-cost job-shops providing market common qualities.

Example:

Cutting of 2" sapphire ingot, c-oriented: From 2,99 EUR/wafer.
Plus with chamfering.

T H I N N I N G   A N D   D I C I N G 

Job-shops:

My-Chip Production GmbH is specialized in low-cost

- thinning,
- grinding/dry-etching and
- dicing - mechanically or by dry-etching -

of silicium wafers.

Thinning we achieve by an almost stress-free technology down to 70 - 100 microns and on special demand even less (20 microns for MEMS).

Also by means of a highly effecient technology we are about to reduce dry dicing time down to ca. 5 min.

You want to convince yourself of our quality?

Following You will find proofs of our achieved qualities. Proofs of other sizes and materials may be received on request.

Please click the topic You are interested in:

	Measurement protocols Si
	Measurement protocols sapphire

R E Q U E S T 

You want to start a request for a personal offer, answering of individual tasks, etc.? Just click here: Request by email or other way of contact.

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