In the fields of silicium we offer our following skills:

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Job-shops:

My-Chip Production GmbH is specialized in low-cost

- thinning,
- grinding/dry-etching and
- dicing - mechanically or by dry-etching -

of silicium wafers.

Thinning we achieve by an almost stress-free technology down to 70 - 100 microns and on special demand even less (20 microns).

Also by means of a highly effecient technology we are about to reduce dicing time down to ca. 5 min.

T H I N N I N G   A N D   D I C I N G 

My-Chip Production is specialized in constructing and producing machines which allow You to

- thin and
- dice

silicium wafers by low-cost means.

Thinning we achieve by an almost stress-free technology down to 70 - 100 µm and on special demand even less.

Also by means of a highly effecient technology we are about to reduce dicing time down to ca. 5 min. This process also simply eliminates the "edge problem" (wafer edge) dicing the wafer into chips - as we know so far.

Single machines may be adjusted to Your working conditions or we may construct and provid complete working lines for You.

Worldwide distribution and service.

You want to convince yourself of our quality?

Following You will find proofs of our achieved qualities. Proofs of other sizes and materials may be received on request.

Please click the topic You are interested in:

	Measurement protocols Si
	Measurement protocols sapphire

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You want to start a request for a personal offer, answering of individual tasks, etc.? Just click here: Request by email or other way of contact.

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