C U T T I N G   O F   B R I T T L E   M A T E R I A L S 

My-Chip Production GmbH cuts

brittle materials

such as
- silicium
- sapphire
- GaAs
- SiC
- piezo
- glass
- magnets
- Al2O3
- all kinds of monocrystals
- compound materials
- etc. in job-shops

C U T T I N G   I N   J O B - S H O P S 

We are focused in very low-cost job-shops providing market common qualities.

Example:

Cutting of 2" sapphire ingot, c-oriented: From 2,99 EUR/wafer.
Also with chamfering.

You want to convince yourself of our quality?

Following You will find proofs of our achieved qualities. Proofs of other sizes and materials may be received on request.

Please click the topic You are interested in:

	Measurement protocols Si
	Measurement protocols sapphire

R E Q U E S T 

You want to start a request for a personal offer, answering of individual tasks, etc.? Just click here: Request by email or other way of contact.

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